双组份导热封灌胶，适用于高温电子组件保护，具备高导热性、自粘性和卓越的绝缘性能。两种流体挤出，在电子组件上混合，提供高效散热和可靠保护。

双组份导热灌封胶：高效热管理与电子组件防护的卓越方案

H-GF-GY 双组份导热灌封胶是一种高导热阻燃性双组份加成型有机硅导热灌封胶，可室温固化，也可加热固化（温度越高固化越快）。其优异的柔性与弹性特征，能完美覆盖不平整表面，将热量从 PCB 或分离器件传导至金属外壳，显著提高发热组件的效率与寿命。

【为什么选择立兴导热灌封胶？】

• 高效传热与稳定性：高导热系数确保传热迅速，有效解决电子器材积热问题。

• 优异的工艺性能：具备自粘接性能，无需底涂液；固化后可掰开，易于元器件修复。

• 强大的环境耐受力：具备卓越的绝缘、防水、耐气候老化及耐高低温性能。

• 防火安全保障：符合 UL 94 V-0 最高阻燃等级，确保电子产品运行安全。

【技术参数表 / Technical Parameters】

1. 固化前与操作性能 (Pre-Curing & Operating)

2. 固化后技术参数 (Post-Curing)

【使用工艺与注意事项】

1. 搅拌混合：混合前将 A、B 胶分别搅拌均匀，按 1:1 重量比配比，误差勿超过 3% 以免影响固化性能。

2. 灌注脱泡：将混合胶料灌入器件，一般可不抽真空。若需极高导热性，建议真空脱泡后再灌注。

3. 固化条件：冬季室温固化慢，建议采用 80°C 加热固化 (20 分钟)，室温则需约 8 小时。

4. 环境影响：环境温度较高时，混合后的操作适用期会相对缩短。

Thermal Conductive Silicone Encapsulant: Premium Solution for Electronic Protection

The H-GF-GY Thermal Conductive Encapsulant is a high thermal conductivity, flame-retardant, two-component addition-cure silicone. It can be cured at room temperature or accelerated by heat. Its flexibility and elasticity allow it to cover uneven surfaces, conducting heat from PCB components to the outer casing, thereby significantly improving the efficiency and service life of high-power devices.

[Why Choose Our Silicone Encapsulant?]

• High Thermal Efficiency: Fast heat transfer ensures rapid cooling of sensitive electronic devices.

• Process Flexibility: Self-adhesive properties eliminate the need for primers; cured material can be pried open for easy component repair.

• Robust Protection: Features excellent insulation, waterproofing, and weather resistance against extreme temperatures and aging.

• Certified Safety: Complies with UL 94 V-0 flame retardancy for maximum safety standards.

[Technical Specifications]

1. Pre-Curing & Operating Performance

2. Post-Curing Technical Parameters

[Usage Instructions & Applications]

• Mixing: Stir components A and B separately before mixing. Maintain a 1:1 weight ratio within a 3% error margin to ensure proper curing.

• Degassing: Vacuum degassing is recommended before pouring if the highest thermal performance is required.

• Curing: Heating to 80°C for 20 minutes is recommended in winter or for fast production cycles.

• Applications: Ideal for high-power LED lamps, power supplies, transformers, sensors, coils, and general electronic component protection.