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Silicone-Aluminum Foil

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Silicone-Aluminum Foil

PCB/FPC Lamination

Silicone-Aluminum Foil

Silicone-aluminum foil provides flatness, thermal conductivity, and cushioning for improved forming, filling, and bonding. Used in flexible circuit manufacturing and electronic component processing. Surface material: silicone + aluminum foil. Density: 1.3±0.2 g/cm³. Colors: brick red and black.

Brand
Lixing Compound Materials
Origin
Zhuhai, Guangdong, China
Supply
Factory direct; custom sizes and cutting available
Samples
Samples available on request

Product Details

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Product details

Name

Silicone-Aluminum Foil

Properties

Good flatness, thermal buffering

Applications

For hot-press applications

Material

Silicone + aluminum foil

Density

1.3g/cm3±0.2 g/cm3

Color

Vermilion
Black

Temperature resistance

over 280°

Hardness

55±5shore A( Silicone )

Thickness

0.4mm ~0.6mm

Dimensions

400mm*510mm (Width*Length)
600mm*700mm (Width*Length)

Silicone elongation

150%±10%

Weight per Unit Area

1000g/㎡±5 g/m2

Tear strength

1.8N/ mm±0.1N/mm

Operating temperature

Black 200 ° ~300°
Vermilion 200 ° ~300°

Operating pressure

80-150kgf/C㎡

Service Life

6000-8000 times

Function


Install on the hot press.
Silicone cushions the workpiece against the heated platen during pressing.
Silicone distributes heat more evenly across the surface and helps prevent burns.

Notice

The heated platen must be flat and free of scratches. Install the material flush against the platen surface.
Cover the silicone surface with fiberglass fabric during use to prevent oil migration from affecting product quality.
The recommended temperature is 160-250°.
Shelf Life (6 months storage temperature: 15-25 ° C Preservation humidity: ≤ 65% RH)

Product characteristic: Silicone Alumimum pad

Dimensions and properties can be customized to meet customer requirements.

Need a recommendation or samples?

Tell us your process temperature, pressure and size requirements, and our engineers will recommend the right material.