




Silicone-Aluminum Foil
PCB/FPC LaminationSilicone-Aluminum Foil
Silicone-aluminum foil provides flatness, thermal conductivity, and cushioning for improved forming, filling, and bonding. Used in flexible circuit manufacturing and electronic component processing. Surface material: silicone + aluminum foil. Density: 1.3±0.2 g/cm³. Colors: brick red and black.
- Brand
- Lixing Compound Materials
- Origin
- Zhuhai, Guangdong, China
- Supply
- Factory direct; custom sizes and cutting available
- Samples
- Samples available on request
Product Details

Product details
Name | Silicone-Aluminum Foil |
Properties | Good flatness, thermal buffering |
Applications | For hot-press applications |
Material | Silicone + aluminum foil |
Density | 1.3g/cm3±0.2 g/cm3 |
Color | Vermilion |
Temperature resistance | over 280° |
Hardness | 55±5shore A( Silicone ) |
Thickness | 0.4mm ~0.6mm |
Dimensions | 400mm*510mm (Width*Length) |
Silicone elongation | 150%±10% |
Weight per Unit Area | 1000g/㎡±5 g/m2 |
Tear strength | 1.8N/ mm±0.1N/mm |
Operating temperature | Black 200 ° ~300° |
Operating pressure | 80-150kgf/C㎡ |
Service Life | 6000-8000 times |
Function |
|
Notice | The heated platen must be flat and free of scratches. Install the material flush against the platen surface. |
Product characteristic: Silicone Alumimum pad
Dimensions and properties can be customized to meet customer requirements.




