PCB/CCL Gold Buffer Pad LX-GB260

A glass fiber and fluorine rubber composite gold buffer pad, available in twill and plain weave, for heat insulation and

Brand

Lixing Compound Materials

Origin

Zhuhai, Guangdong, China

Supply

Factory direct; custom sizes and cutting available

Samples

Samples available on request

Product Details

A glass fiber and fluorine rubber composite gold buffer pad, available in twill and plain weave, for heat insulation and cushioning of press plates in PCB/CCL lamination.

The PCB/CCL Gold Buffer Pad LX-GB260 is a glass fiber and fluorine rubber composite with a golden-yellow surface, used for heat insulation and cushioning of press plates in PCB/CCL lamination.

Twill and plain weave

Two surface textures are available: twill with a deeper texture and plain weave with a shallower texture. Material and specifications are the same, so the weave can be chosen to suit the process.

Features and applications

Composite structure of glass fiber and fluorine rubber.
Heat resistance ≤260 °C, suited to the high temperatures of lamination.
Cushioning >12%, tensile strength ≥25 MPa.
Thickness tolerance ±0.3 mm, dimensional tolerance (L/W) +2/-1 mm.
500 press cycles.
Suitable for heat insulation and cushioning of press plates in PCB/CCL lamination.

Specifications

Item	Value	Unit
Composition	Glass fiber + fluorine rubber
Weave	Twill (deep texture) / plain (shallow texture)
Application	Heat insulation and cushioning of press plates in PCB/CCL lamination
Color	Golden yellow, no obvious color difference
Water absorption	<7	%
Thickness tolerance	Nominal ±0.3	mm
Cushioning	>12	%
Tensile strength	≥25	MPa
Heat resistance	≤260	°C
Thermal shrinkage	0 (240°C × 120 min)	mm
Press cycles	500	cycles
Dimensional tolerance (L/W)	+2/-1	mm
Diagonal (squareness)	≤2	mm