Lixing high-temperature press cushion pad
The pad uses a PTFE (Teflon) nano-coating as its release layer; inside, it is a multilayer composite of high-elasticity fluororesin fiber fabric, high-temperature heat-conductive fluororesin and high-tensile fluororesin fiber fabric.

Lixing High-Temperature Press Cushion Pad: Precision Lamination for PCB and IC Substrates

Reusable PTFE-Coated Press Pad for PCB & IC Substrate Lamination

In high-end electronics manufacturing, the high-temperature press cushion pad has become a key consumable for improving product quality. Developed by Lixing Composite Materials, this pad uses an advanced Teflon (PTFE) nano-coating as its release layer and maintains excellent performance under extreme process conditions.

Why Choose the Lixing High-Temperature Press Cushion Pad?

The internal structure of this high-temperature press cushion pad is highly engineered: multiple layers of high-elasticity fluororesin fiber fabric, high-temperature heat-conductive fluororesin and high-tensile fluororesin fiber fabric. With its nano release treatment, it solves many of the pain points of conventional lamination processes:

• Outstanding temperature resistance: Operates stably at temperatures up to 280°C.

• Extreme compressive strength: Withstands pressures above 45 Kg/cm², ensuring uniform lamination pressure.

• Replaces conventional materials: An ideal replacement for traditional kraft paper and silicone pads, with non-stick, reusable performance.

Technical Specifications & Applications

For the precision lamination of PCBs, FPCs, rigid-flex boards and IC substrates, our high-temperature press cushion pad offers the following parameters:

Complete Lamination Solution Set

For the best lamination results, we recommend pairing this high-temperature press cushion pad with other Lixing core products:

1. Silicone Iron Pad: Provides structural support and uniform heat distribution.

2. FPC Green Cushioning Pad: Enhances local pressure compensation.

3. PTFE (Teflon) Tape and Polyimide Gold-Finger Tape: For edge protection and insulation.

For more on international standards for circuit board manufacturing, please refer to the official specifications of the IPC (Association Connecting Electronics Industries).

Lixing High-Temperature Press Cushion Pad: Premium Lamination Solution for PCB & IC Substrates

The High-Temperature Press Cushion Pad is an essential consumable for high-end manufacturing in the modern electronics industry. Developed by Lixing, this High-Temperature Press Cushion Pad utilizes advanced Teflon (PTFE) nano-coating technology as an anti-stick layer, ensuring stable performance under extreme processing conditions. It is the ideal long-term solution to replace traditional kraft paper and silicone pads in precision lamination.

Why Choose the Lixing High-Temperature Press Cushion Pad?

The internal structure of this High-Temperature Press Cushion Pad is engineered with multiple layers, including high-elastic PTFE fiber fabric, high-temperature heat-conductive fluororesin, and fluororesin high-tensile fiber fabric. By integrating a nano-release coating, it effectively addresses common pain points in the lamination process:

• Extreme Temperature Resistance: This High-Temperature Press Cushion Pad operates stably in environments up to 280°C.

• Superior Pressure Durability: With a pressurization capacity exceeding 45 Kg/cm², it ensures uniform pressure distribution during lamination.

• Sustainable Efficiency: Designed as a reusable alternative to kraft paper, it offers non-stick properties and a significantly longer service life, reaching approximately 600 cycles.

Technical Specifications & Applications

Our High-Temperature Press Cushion Pad is specifically designed for the lamination of PCBs, FPCBs, Rigid-Flex boards, IC substrates, HDI, and high-frequency/high-speed boards.

Integrated Lamination Solutions

To achieve the highest production yields, we recommend using the High-Temperature Press Cushion Pad in combination with Lixing’s core product suite:

1. Silicone Iron Pads (Lamination Steel Pads): For structural support and even heat distribution.

2. FPC Green Cushioning Pads: For enhanced local pressure compensation.

3. PTFE (Teflon) Film Tapes & Polyimide Tapes: For edge protection and high-temp insulation.

For further technical standards regarding circuit board manufacturing, please refer to the IPC (Association Connecting Electronics Industries) official guidelines.