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YD-08-YL Polyimide Gold Finger Tape

YD-08-YL Polyimide Gold Finger Tape image 1YD-08-YL Polyimide Gold Finger Tape image 2

YD-08-YL Polyimide Gold Finger Tape

PCB/FPC Lamination

YD-08-YL Polyimide Gold Finger Tape

YD-08-YL Polyimide Gold Finger Tape Made from high-performance polyimide film with a high-temperature silicone adhesive,

Brand
Lixing Compound Materials
Origin
Zhuhai, Guangdong, China
Supply
Factory direct; custom sizes and cutting available
Samples
Samples available on request

Product Details

YD-08-YL Polyimide Gold Finger Tape
Made from high-performance polyimide film with a high-temperature silicone adhesive, offering excellent heat resistance, acid and alkali resistance and electrical insulation. Suitable for high-temperature painting, securing electronic components, PCB process masking and baked-finish coating operations. Peels off without adhesive residue, leaving a smooth, flat surface, for all kinds of precision electronics manufacturing.

Polyimide Gold Finger Tape: High-Voltage Protection and Extreme Heat Resistance

In printed circuit board (PCB) manufacturing and high-end electronic packaging, gold finger tape is a core protective material that keeps electronic components free from contamination and damage in high-temperature environments. The YD-08-YL polyimide gold finger tape from Lixing Composite Materials uses a high-performance polyimide film backing combined with a professional-grade silicone pressure-sensitive adhesive, delivering excellent insulation, chemical stability and heat resistance.

Why Choose Lixing Gold Finger Tape?

  • Extreme heat resistance: Withstands 260°C for 30 minutes without deformation and peels cleanly while hot with no adhesive residue, effectively reducing cleaning costs.

  • Superior insulation: Withstand voltage up to 8kV and surface resistivity above 10^13 Ω ensure safe electrical connections.

  • Excellent chemical stability: Resists acids, alkalis, solvents and chemical agents, making it suitable for demanding plating and paint-masking processes.

  • High mechanical strength: Tensile strength ≥ 40 MPa provides excellent tension resistance, so the tape does not break easily during application or rewinding.

  • Precise peel force control: Stable inner- and outer-layer peel force (≥ 100g/5mm) ensures consistency in automated tape application.

Product Properties

ItemUnitSpecificationTest Method
Model Number—YD-08-YL—
Color—AmberVisual
Backing Thicknessmm0.025 ± 0.0005GB/T 7125-1990
Total Thicknessmm0.065 ± 0.005GB/T 7125-1990
Tensile StrengthMPa≥ 40GB/T 7753-1987
Elongation at Break%≥ 50GB/T 7753-1987
Withstand VoltagekV≥ 8GB/T 8554-1993
Surface ResistivityΩ≥ 10^13ASTM D4496
Heat Resistance°C260°C / 30 min304 mirror-finish steel plate test
Peel Forceg/5mm≥ 100GB/T 2792-1998

Polyimide “Gold Finger” Tape: Premium Solution for High-Voltage & Thermal Protection

In the field of Printed Circuit Board (PCB) manufacturing and high-end electronic packaging, Gold Finger Tape is a core protective material that ensures electronic components are shielded from contamination and damage in high-temperature environments. The YD-08-YL Polyimide Gold Finger Tape provided by Lixing features a high-performance polyimide film substrate combined with a professional-grade silicone pressure-sensitive adhesive, delivering excellent insulation, chemical stability, and heat resistance.

[Why Choose Our Polyimide Tape?]

  • High-Temperature Resistance: Withstands up to 260°C for 30 minutes without deformation, ensuring clean, residue-free removal after high-temp processing.

  • Superior Electrical Insulation: Rated for ≥ 8kV breakdown voltage with a surface resistivity above 10^13 Ω, ensuring electrical connection safety.

  • Industrial Durability: Resistant to acids, alkalis, and solvents, providing robust protection during demanding plating and paint-masking processes.

  • Robust Mechanical Strength: Tensile strength ≥ 40 MPa ensures excellent tension resistance and prevents breakage during application and rewinding.

  • Precise Peel Force Control: Stable inner and outer layer peel strength (≥ 100g/5mm) ensures consistency during automated lamination and tape application.

[Technical Specifications]

ItemUnitSpecificationTest Method
Model Number—YD-08-YL—
Color—AmberVisual
Substrate Thicknessmm0.025 ± 0.0005GB/T 7125-1990
Total Thicknessmm0.065 ± 0.005GB/T 7125-1990
Tensile StrengthMPa≥ 40GB/T 7753-1987
Elongation at Break%≥ 50GB/T 7753-1987
Withstand VoltagekV≥ 8GB/T 8554-1993
Surface ResistivityΩ≥ 10^13ASTM D4496
Temp Resistance°C260°C / 30 min304 Mirror Steel Test
Peel Forceg/5mm≥ 100GB/T 2792-1998

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