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G-TT-GY Fiberglass-Reinforced Thermal Conductive Silicone Tube

G-TT-GY Fiberglass-Reinforced Thermal Conductive Silicone Tube

Silicone Tubing

G-TT-GY Fiberglass-Reinforced Thermal Conductive Silicone Tube

The G-TT-GY fiberglass-reinforced thermal conductive silicone tube has a ring-shaped fiberglass cloth reinforcement laye

Brand
Lixing Compound Materials
Origin
Zhuhai, Guangdong, China
Supply
Factory direct; custom sizes and cutting available
Samples
Samples available on request

Product Details

The G-TT-GY fiberglass-reinforced thermal conductive silicone tube has a ring-shaped fiberglass cloth reinforcement layer embedded in the center of the tube wall. It offers 1.5 ± 0.3 W/m·K thermal conductivity, electrical insulation, soft compressibility and UL 94 V-0 flame retardancy, for power transistors, MOSFETs, ICs, power modules and all kinds of electronic heat dissipation protection.

Product Overview

The G-TT-GY fiberglass-reinforced thermal conductive silicone tube is made from a silicone rubber base filled with thermally conductive fillers such as aluminum oxide and boron nitride, with a ring of fiberglass cloth embedded in the center of the tube wall as reinforcement. It combines thermal conductivity, electrical insulation, cushioning and structural stability, and maintains low thermal resistance even under low mounting pressure.

In liquid-encapsulation applications, the tube offers high burst pressure and good heat transfer, making it suitable for the insulated heat dissipation of power transistors, MOSFETs, ICs and power modules.

Product Features

  • Soft and compressible, conforming to the gap between the component and the heat sink
  • Slightly tacky, so no additional adhesive is usually required
  • Ring-shaped fiberglass cloth reinforcement in the center of the tube wall improves dimensional stability and pressure resistance
  • Combines thermal conductivity, insulation and cushioning
  • UL 94 V-0 flame rating
  • Operating temperature range: -40 to 200°C

Applications

  • Heat transfer and insulation between semiconductors and heat sinks
  • Communication equipment
  • Computer memory chips and graphics card cooling modules
  • Modules with high thermal conductivity requirements and LCD backlight modules
  • Power transistors, MOSFETs, ICs and power modules
  • Fire-protection equipment

Technical Specifications

PropertyValueTest standard
Thermal conductivity1.5 ± 0.3 W/m·KISO 22007-2
Wall thickness5–10 mmASTM D374
Density3.1 g/cm³ASTM D792
Hardness30–70 Shore 00ASTM D2240
Electrical resistivity1012 Ω·cmASTM D257
Dielectric breakdown voltage≥ 3 kVASTM D149
FlammabilityV-0UL 94
Operating temperature range-40 to 200°C—
Tensile strength2–4 MPaASTM D412
Elongation at break10–70%ASTM D412

The values above are typical test data; actual specifications can be confirmed according to size and custom requirements.

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