H-GT-WH Fiberglass Thermal Conductive Tape provides a thin thermal path, electrical insulation, and self-adhesive fixing for heat-dissipation parts. Procurement and process engineers can begin with the disclosed 0.5 kg/25 mm loop tack, 24 H holding power, and -20°C to 120°C operating range, then verify bonding on the actual substrate. These values address initial positioning, sustained loading, and environment separately, so one result cannot replace another.

Initial tack helps parts stay positioned

The H-GT-WH fiberglass thermal tape uses a uniform adhesive layer and lists 0.5 kg/25 mm loop tack. This value is relevant to the tape's early grab after contact, which matters when positioning high-power LED modules, notebook cooling parts, and touch-panel components.

The fiberglass carrier supports handling

The fiberglass carrier provides structural and tensile support while the product maintains a total thickness of 0.095 ± 0.005 mm. Its roll format can be converted for power-conversion equipment and heat-sink assemblies. Actual die-cut tolerances and assembly fixtures still need confirmation against the production drawing.

Thermal fixing can retain electrical separation

The official product page lists thermal conductivity of 0.35 W/(m·K) and withstand voltage of 5 kV. These disclosed properties support the listed LED, LCD, power-supply, and heat-sink applications, but a material value alone cannot predict system temperature rise or an assembly's insulation margin.

Compare adhesion under controlled conditions

The engineering model for peel strength is P = F_avg / b, where P is peel strength (N/mm), F_avg is the average force over the stable peel region (N), and b is specimen width (mm). Instron's peel testing reference describes peel strength as average force per specimen width. The comparison is meaningful only when substrate, surface preparation, application pressure, dwell time, peel angle, and rate are controlled. ASTM D3330 also cautions that peel adhesion usually has no direct relationship to a functional requirement.

Sample each adhesion behavior separately

Loop tack addresses early positioning, adhesion to polished steel describes bonding under a specified steel-panel condition, and holding power observes behavior under sustained load. Start with the disclosed H-GT-WH specifications, then evaluate cleaned production substrates, coatings, plastics, temperature exposure, and the intended load.

Validate the actual substrate before release

H-GT-WH is a source-backed starting point when an assembly needs thin thermal transfer, insulation, and adhesive fixing. Share the substrate, surface condition, bond area, operating temperature, and load with Lixing Composite Materials Co., Ltd. to request samples and specification support.

#FiberglassThermalTape #ThermalManagement #Adhesion #ElectronicsCooling