Aluminum Foil Thermal Tape Adhesion: Tack, Peel and Holding Power for Stable Heat Sink Bonding

When you use aluminum foil thermal tape to hold a heat sink, an LED strip or the back of a panel, the selection question comes down to three things: does it grab during alignment, does it resist peeling once pressed down, and does it stay put while hanging on a vertical face. The H-TT-AL datasheet gives one number for each: 0.6 kg/25mm loop tack, 1.5 kg/25mm adhesion to steel plate and 24 hours of holding power. Use these three to judge whether the tape fits your bonding load, then sample it on your real substrate with the test conditions agreed in advance.
Three adhesion numbers, three bonding questions
It grabs the moment it touches
Loop tack of 0.6 kg/25mm measures the grip when the adhesive just touches a surface with almost no pressure. On an assembly line, the tape stays where it lands on an LED strip or heat sink, so the operator can align it before pressing it down.
Once pressed, it resists peeling
Adhesion to steel plate of 1.5 kg/25mm describes the force needed to peel the tape from steel after it has been pressed on. It is higher than the tack value, which reflects fuller contact once pressure is applied. The two tests are run differently, so dividing one number by the other says little.
It holds on vertical faces
Holding power of 24 hours reflects how long the tape carries a constant shear load. The product page lists securing heat sinks in power conversion equipment and transformers as an application, and those parts often hang on side or vertical faces, where holding power says more about long-term behavior than tack does. The load and temperature of the holding test are not listed, so confirm them with Lixing.
A 0.040 mm adhesive layer keeps the heat path short
The adhesive is 0.040 ± 0.003 mm and the aluminum face stock 0.060 ± 0.003 mm, which add up to the listed total thickness of 0.100 ± 0.005 mm; the 0.055 mm transparent PET release liner comes off during application. Bonding and heat transfer share one thin layer with a thermal conductivity of 0.45 W/(m·K), so the heat path needs no extra fixing layer. For the trade-off between thickness and conductivity, see our thermal-interface analysis of aluminum foil tape.
Rated for -30°C to 150°C
The product page lists an operating range of -30°C to 150°C, which suits parts that must stay bonded from cold storage to hot operation. Pressure-sensitive adhesion changes with temperature, so if the bond sits near the upper limit for long periods, run a holding check at that temperature.
Where it is used: from LED strips to power supply heat sinks
- LED strips and high-power fixtures: bond the strip to an aluminum profile so it is fixed and cooled at once.
- Notebooks, tablets and mobile devices: thermal management and bonding in thin enclosures.
- Touch panels and LCD modules: listed for heat regulation and bonding.
- Power conversion equipment and transformers: securing heat sinks.
Why peel numbers depend on angle: the thin-film peel equation
Kendall's 1975 thin-film peeling analysis (Journal of Physics D: Applied Physics, 8(13), 1449–1452) shows that when the backing barely stretches, peel force and adhesive fracture energy are related by:
G = (F/b) × (1 − cos θ)
- G: adhesive fracture energy per unit area (J/m²)
- F: steady-state peel force (N)
- b: tape width (m)
- F/b: peel force per unit width (N/m)
- θ: angle between the peel arm and the substrate (degrees)
Converted, 1.5 kg/25mm is about 14.7 N per 25 mm, or roughly 588 N/m. If that value were measured at 180°, G would be about 1,180 J/m²; at 90° it would be about 590 J/m², a factor of two apart. The product page does not state the peel angle or speed, so this worked example only shows why conditions must match before you compare data. It is not the adhesive fracture energy of H-TT-AL.
Applicability and limits: the equation covers steady peeling of a thin tape whose backing barely stretches. Aluminum foil bends plastically during peel and absorbs part of the energy, the adhesive responds to peel speed and temperature, and surface oil and dwell time also shift the result. It is an engineering model, not a product specification or guarantee.
What to prepare before sampling
- Substrate and surface finish, for example anodized aluminum or a plastic housing
- Bond area, tape width and whether die-cutting is needed
- Operating temperature at the bond and whether it carries a vertical load
- The peel angle, peel speed and holding load you want to compare against
Conclusion
Tack decides whether the tape grabs during alignment, peel reflects the bond after pressing, and holding power covers long-term hanging loads. H-TT-AL lists all three on its datasheet, together with a 0.040 mm adhesive layer and a -30°C to 150°C operating range, which suits LED and power supply heat-sink parts that need bonding and heat transfer in one layer. Check the full datasheet on the H-TT-AL aluminum foil thermal tape product page, or email yw@zh-lx.com to request samples or a specification consultation.
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